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S98GL064NB0HI0073
S98GL064NB0HI0073
Multi-Chip Package Memory S98GL064NB0HI0073
Cypress
S98GL064NB0HI0073
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Memory
Multi-Chip Package Memory
Specification
Product AttributeAttribute Value
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.B.1.A
Pin Count56
Lead ShapeBall
PCB changed56
Part StatusObsolete
Organization4Mx16 Flash + 2Mx16 PSRAM
Package Width7
Package Height0.97(Max)
Package Length9
ProgrammabilityYes
Supplier PackageFBGA
Process Technology110nm, MirrorBit
Standard Package NameBGA
SRAM Memory Size (bit)32M
Flash Memory Size (bit)64M
Supplier Temperature GradeIndustrial
SRAM Maximum Access Time (ns)70
Flash Maximum Access Time (ns)90
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Description
MCP 4Mx16 Flash + 2Mx16 PSRAM 3V/3.3V 56-Pin FBGA
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Product Compliance
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