HTS | 8542.33.00.01 |
PPAP | No |
Type | High Speed Amplifier |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 8 |
Part Status | Active |
Rail to Rail | Rail to Rail Input/Output |
Package Width | 4(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC N |
Manufacturer Type | High Speed Amplifier |
Minimum CMRR (dB) | 56 |
Minimum PSRR (dB) | 75 |
Power Supply Type | Dual|Single |
Shut Down Support | No |
Process Technology | XFCB |
Standard Package Name | SOP |
Minimum CMRR Range (dB) | 50 to 60 |
Typical Slew Rate (V/us) | 32@5V |
Typical Voltage Gain (dB) | 82 |
Supplier Temperature Grade | Industrial |
Typical Settling Time (ns) | 125 |
Number of Channels per Chip | 2 |
Typical Output Current (mA) | 15@5V |
Maximum Power Dissipation (mW) | 800 |
Maximum Quiescent Current (mA) | 2.8@5V |
Maximum Dual Supply Voltage (V) | ±6 |
Maximum Input Bias Current (uA) | 1.2@5V |
Minimum Dual Supply Voltage (V) | ±1.35 |
Typical Dual Supply Voltage (V) | ±5 |
Typical Input Bias Current (uA) | 0.45@5V |
Maximum Input Offset Current (uA) | 0.25@5V |
Maximum Input Offset Voltage (mV) | 1.5@5V |
Maximum Single Supply Voltage (V) | 12 |
Minimum Single Supply Voltage (V) | 2.7 |
Typical Single Supply Voltage (V) | 5 |
Input Offset Voltage Drift (uV/°C) | 5(Typ) |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Typical Gain Bandwidth Product (MHz) | 50 |
Typical Low Level Output Voltage (V) | 0.1 |
Typical High Level Output Voltage (V) | 4.98 |
Typical Input Noise Voltage Density (nV/rtHz) | 15@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 5@5V |
Description | |