Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 81 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 81 |
Part Status | Obsolete |
JTAG Support | Yes |
Package Width | 9.1(Max) |
Integrated CDR | Yes |
Package Height | 1.2(Max) |
Package Length | 9.1(Max) |
Supplier Package | LFBGA |
Maximum Data Rate | 2.5Gbps |
Power Supply Type | Analog|Digital |
Process Technology | CMOS |
Standard Supported | IEEE 1149.1 |
Standard Package Name | BGA |
PHY Line Side Interface | No |
Supplier Temperature Grade | Industrial |
Maximum Supply Current (mA) | 28 |
Number of Channels per Chip | 1 |
Maximum Power Dissipation (mW) | 300 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.3|2.7|3.6 |
Minimum Operating Supply Voltage (V) | 1.15|2.3|3 |
Typical Operating Supply Voltage (V) | 1.2|2.5|3.3 |
Description |