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RF FETs BLF6G38-10,112
NXP
BLF6G38-10,112
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Diodes, Transistors and Thyristors
RF FETs
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Bulk |
| Pin Count | 3 |
| Automotive | No |
| PCB changed | 3 |
| Channel Mode | Enhancement |
| Channel Type | N |
| Maximum VSWR | 10 |
| Configuration | Single |
| Package Width | 6.93(Max) |
| Package Height | 3.63(Max) |
| Package Length | 6.93(Max) |
| Output Power (W) | 2(Typ) |
| Supplier Package | CDFM |
| Mode of Operation | 1-Carrier N-CDMA |
| Process Technology | LDMOS |
| Maximum Frequency (MHz) | 3600 |
| Minimum Frequency (MHz) | 3400 |
| Typical Power Gain (dB) | 14 |
| Number of Elements per Chip | 1 |
| Typical Drain Efficiency (%) | 20 |
| Maximum Gate Source Voltage (V) | 13 |
| Maximum Drain Source Voltage (V) | 65 |
| Maximum Operating Temperature (°C) | 200 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Continuous Drain Current (A) | 3.1 |
| Typical Forward Transconductance (S) | 0.8(Min) |
| Maximum Drain Source Resistance (mOhm) | 1256@6.15V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 3.6@28V |
| Description |
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