Product Attribute | Attribute Value |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 4 |
PCB changed | 4 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Dual Common Source |
Package Width | 9.96 |
Package Height | 3.6 |
Package Length | 20.57 |
Output Power (W) | 35(Typ) |
Supplier Package | HSOP-F |
Maximum IDSS (uA) | 1.4 |
Mode of Operation | 2-Carrier W-CDMA |
Process Technology | LDMOS |
Maximum Frequency (MHz) | 1000 |
Minimum Frequency (MHz) | 700 |
Typical Power Gain (dB) | 20.6 |
Number of Elements per Chip | 2 |
Typical Drain Efficiency (%) | 29 |
Maximum Gate Source Voltage (V) | 13 |
Maximum Drain Source Voltage (V) | 65 |
Maximum Gate Threshold Voltage (V) | 2.3 |
Maximum Operating Temperature (°C) | 225 |
Minimum Operating Temperature (°C) | -65 |
Typical Forward Transconductance (S) | 6.7 |
Maximum Drain Source Resistance (MOhm) | 190(Typ)@6.05V |
Maximum Gate Source Leakage Current (nA) | 140 |
Description |