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CY62167G30-55BVXE
CY62167G30-55BVXE
SRAM Chip CY62167G30-55BVXE
Cypress
CY62167G30-55BVXE
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.B.2.A
PackagingTray
Pin Count48
AutomotiveYes
Lead ShapeBall
PCB changed48
Part StatusActive
Timing TypeAsynchronous
Package Width6
Package Height0.81(Max)
Package Length8
Number of Ports1
Number of Words1M
Supplier PackageVFBGA
Chip Density (bit)16M
Process Technology65nm
Max. Access Time (ns)55
Standard Package NameBGA
Data Rate ArchitectureSDR
Operating Current (mA)40
Address Bus Width (bit)20
Number of Bits/Word (bit)16
Supplier Temperature GradeAutomotive
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.2
Typical Operating Supply Voltage (V)2.5|3|3.3
Description
SRAM Chip Async Single 2.5V/3V/3.3V 16M-bit 1M x 16 55ns Automotive 48-Pin VFBGA Tray
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