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CY7C1062GE30-10BGXI
CY7C1062GE30-10BGXI
SRAM Chip CY7C1062GE30-10BGXI
Cypress
CY7C1062GE30-10BGXI
--
Memory
SRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.41
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991b.2.a.
PackagingTray
Pin Count119
AutomotiveNo
Lead ShapeBall
PCB changed119
Part StatusActive
Timing TypeAsynchronous
Package Width14
Package Height1.46
Package Length22
Number of Ports1
Number of Words512K
Supplier PackageBGA
Chip Density (bit)16M
Process Technology65nm, CMOS
Max. Access Time (ns)10
Standard Package NameBGA
Data Rate ArchitectureSDR
Operating Current (mA)110
Address Bus Width (bit)19
Number of Bits/Word (bit)32
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.2
Typical Operating Supply Voltage (V)2.5|3.3
Description
SRAM Chip Async Single 2.5V/3.3V 16M-bit 512K x 32 10ns 119-Pin BGA Tray
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