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CY7C1163KV18-550BZC
CY7C1163KV18-550BZC
SRAM Chip CY7C1163KV18-550BZC
Cypress
CY7C1163KV18-550BZC
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.41
PPAPNo
EU RoHSNot Compliant
MountingSurface Mount
ECCN (US)3A991.B.2.A
PackagingTray
Pin Count165
AutomotiveNo
Lead ShapeBall
PCB changed165
Part StatusActive
Timing TypeSynchronous
ArchitecturePipelined
Package Width13
Package Height0.89
Package Length15
Number of Ports2
Number of Words1M
Supplier PackageFBGA
Chip Density (bit)18M
Max. Access Time (ns)0.45
Standard Package NameBGA
Data Rate ArchitectureQDR
Operating Current (mA)780
Address Bus Width (bit)18
Maximum Clock Rate (MHz)550
Number of Bits/Word (bit)18
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
SRAM Chip Sync Dual 1.8V 18M-bit 1M x 18 0.45ns 165-Pin FBGA Tray
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