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CY7C1361C-100BZXET
CY7C1361C-100BZXET
SRAM Chip CY7C1361C-100BZXET
Cypress
CY7C1361C-100BZXET
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.41
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.B.2.B
PackagingTape and Reel
Pin Count165
AutomotiveYes
Lead ShapeBall
PCB changed165
Part StatusActive
Timing TypeSynchronous
ArchitectureFlow-Through
Package Width13
Package Height0.89
Package Length15
Number of Ports4
Number of Words256K
Supplier PackageFBGA
Chip Density (bit)9M
Process Technology90nm, CMOS
Max. Access Time (ns)8.5
Standard Package NameBGA
Data Rate ArchitectureSDR
Operating Current (mA)180
Address Bus Width (bit)18
Maximum Clock Rate (MHz)100
Number of Bits/Word (bit)36
Supplier Temperature GradeAutomotive
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3.135
Typical Operating Supply Voltage (V)3.3
Description
SRAM Chip Sync Quad 3.3V 9M-bit 256K x 36 8.5ns Automotive 165-Pin FBGA T/R
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