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CY7C1414KV18-300BZXC
CY7C1414KV18-300BZXC
SRAM Chip CY7C1414KV18-300BZXC
Cypress
CY7C1414KV18-300BZXC
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.41
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991b.2.a.
PackagingTray
Pin Count165
AutomotiveNo
Lead ShapeBall
PCB changed165
Part StatusActive
Timing TypeSynchronous
ArchitecturePipelined
Package Width13
Package Height0.89
Package Length15
Number of Ports2
Number of Words1M
Supplier PackageFBGA
Chip Density (bit)36M
Process Technology65nm, CMOS
Max. Access Time (ns)0.45
Standard Package NameBGA
Data Rate ArchitectureQDR
Operating Current (mA)850
Address Bus Width (bit)21
Maximum Clock Rate (MHz)300
Number of Bits/Word (bit)36
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
SRAM Chip Sync Dual 1.8V 36M-bit 1M x 36 0.45ns 165-Pin FBGA Tray
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