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CY7C1460KVE33-167BZC
CY7C1460KVE33-167BZC
SRAM Chip CY7C1460KVE33-167BZC
Cypress
CY7C1460KVE33-167BZC
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSNot Compliant
MountingSurface Mount
ECCN (US)3A991.B.2.B
Pin Count165
AutomotiveNo
Lead ShapeBall
PCB changed165
Part StatusActive
Timing TypeSynchronous
ArchitecturePipelined
Package Width15
Package Height0.89
Package Length17
Number of Ports1
Number of Words1M
Supplier PackageFBGA
Chip Density (bit)36M
Process Technology65nm, CMOS
Max. Access Time (ns)3.4
Standard Package NameBGA
Data Rate ArchitectureSDR
Operating Current (mA)190
Address Bus Width (bit)3
Maximum Clock Rate (MHz)167
Number of Bits/Word (bit)36
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3.135
Typical Operating Supply Voltage (V)3.3
Description
SRAM Chip Sync Single 3.3V 36M-bit 1M x 36 3.4ns 165-Pin FBGA Tray
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