Product Attribute | Attribute Value |
HTS | 8542.32.00.41 |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Surface Mount |
ECCN (US) | 3A991.B.2.A |
Packaging | Tray |
Pin Count | 209 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 209 |
Part Status | Active |
Timing Type | Synchronous |
Architecture | Pipelined |
Package Width | 14 |
Package Height | 1.26 |
Package Length | 22 |
Number of Ports | 8 |
Number of Words | 1M |
Supplier Package | FBGA |
Chip Density (bit) | 72M |
Process Technology | 90nm, CMOS |
Max. Access Time (ns) | 3 |
Standard Package Name | BGA |
Data Rate Architecture | SDR |
Operating Current (mA) | 450 |
Address Bus Width (bit) | 20 |
Maximum Clock Rate (MHz) | 200 |
Number of Bits/Word (bit) | 72 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 70 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 2.625 |
Minimum Operating Supply Voltage (V) | 2.375 |
Typical Operating Supply Voltage (V) | 2.5 |
Description |