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CY7C1474V25-200BGC
CY7C1474V25-200BGC
SRAM Chip CY7C1474V25-200BGC
Cypress
CY7C1474V25-200BGC
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.41
PPAPNo
EU RoHSNot Compliant
MountingSurface Mount
ECCN (US)3A991.B.2.A
PackagingTray
Pin Count209
AutomotiveNo
Lead ShapeBall
PCB changed209
Part StatusActive
Timing TypeSynchronous
ArchitecturePipelined
Package Width14
Package Height1.26
Package Length22
Number of Ports8
Number of Words1M
Supplier PackageFBGA
Chip Density (bit)72M
Process Technology90nm, CMOS
Max. Access Time (ns)3
Standard Package NameBGA
Data Rate ArchitectureSDR
Operating Current (mA)450
Address Bus Width (bit)20
Maximum Clock Rate (MHz)200
Number of Bits/Word (bit)72
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)2.625
Minimum Operating Supply Voltage (V)2.375
Typical Operating Supply Voltage (V)2.5
Description
SRAM Chip Sync Octal 2.5V 72M-bit 1M x 72-bit 3ns 209-Pin FBGA Tray
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