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CY7C1612KV18-360BZXC
CY7C1612KV18-360BZXC
SRAM Chip CY7C1612KV18-360BZXC
Cypress
CY7C1612KV18-360BZXC
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.41
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.B.2.A
PackagingTray
Pin Count165
AutomotiveNo
Lead ShapeBall
PCB changed165
Part StatusActive
Timing TypeSynchronous
ArchitecturePipelined
Package Width15
Package Height0.89
Package Length17
Number of Ports2
Number of Words8M
Supplier PackageFBGA
Chip Density (bit)144M
Process TechnologyCMOS
Max. Access Time (ns)0.45
Standard Package NameBGA
Data Rate ArchitectureQDR
Operating Current (mA)1025
Address Bus Width (bit)44
Maximum Clock Rate (MHz)360
Number of Bits/Word (bit)18
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
SRAM Chip Sync Dual 1.8V 144M-bit 8M x 18 0.45ns 165-Pin FBGA Tray
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