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CY7C2270KV18-550BZXI
CY7C2270KV18-550BZXI
SRAM Chip CY7C2270KV18-550BZXI
Cypress
CY7C2270KV18-550BZXI
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.B.2.A
PackagingTray
Pin Count165
AutomotiveNo
Lead ShapeBall
PCB changed165
Part StatusActive
Timing TypeSynchronous
ArchitecturePipelined
Package Width13
Package Height0.89
Package Length15
Number of Ports1
Number of Words1M
Supplier PackageFBGA
Chip Density (bit)36M
Max. Access Time (ns)0.45
Standard Package NameBGA
Data Rate ArchitectureDDR
Operating Current (mA)890
Address Bus Width (bit)19
Maximum Clock Rate (MHz)550
Number of Bits/Word (bit)36
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
SRAM Chip Sync Single 1.8V 36M-bit 1M x 36 0.45ns 165-Pin FBGA Tray
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