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K6X8016C3B-UF55000
K6X8016C3B-UF55000
SRAM Chip K6X8016C3B-UF55000
Samsung Electronics
K6X8016C3B-UF55000
--
Memory
SRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.b.2.a
PackagingTray
Pin Count44
AutomotiveNo
Lead ShapeGull-wing
PCB changed44
Part StatusObsolete
Timing TypeAsynchronous
Package Width10.16
Package Height1
Package Length18.81(Max)
Number of Ports1
Number of Words512K
Supplier PackageTSOP-II
Chip Density (bit)8M
Max. Access Time (ns)55
Standard Package NameSOP
Data Rate ArchitectureSDR
Operating Current (mA)35
Address Bus Width (bit)19
Number of Bits/Word (bit)16
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)5.5
Minimum Operating Supply Voltage (V)4.5
Typical Operating Supply Voltage (V)5
Description
SRAM Chip Async Single 5V 8M-bit 512K x 16 55ns 44-Pin TSOP-II Tray
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