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STM8S003F3P6TRATMEGA48PA-AUAT24C512C-SSHD-TSTM32L031G6U6TPS74801DRCR
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SRAM Chip K7D803671B-HC33000
Samsung Electronics
K7D803671B-HC33000
--
Memory
SRAM Chip
K7D803671B-HC33000.pdf
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSNot Compliant
MountingSurface Mount
ECCN (US)3A991.b.2.a
PackagingTray
Pin Count153
AutomotiveNo
Lead ShapeBall
PCB changed153
Part StatusObsolete
Timing TypeSynchronous
ArchitecturePipelined
Package Width14
Package Height1.61(Max)
Package Length22
Number of Ports1
Number of Words256K
Supplier PackageBGA
Chip Density (bit)9M
Process TechnologyCMOS
Max. Access Time (ns)1.7
Standard Package NameBGA
Data Rate ArchitectureDDR
Operating Current (mA)750
Address Bus Width (bit)18
Maximum Clock Rate (MHz)333
Number of Bits/Word (bit)36
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)2.63
Minimum Operating Supply Voltage (V)2.37
Typical Operating Supply Voltage (V)2.5
Description
SRAM Chip Sync Single 2.5V 9M-bit 256K x 36 1.7ns 153-Pin BGA Tray
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