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K7I163682B-EC30000
K7I163682B-EC30000
SRAM Chip K7I163682B-EC30000
Samsung Electronics
K7I163682B-EC30000
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Memory
SRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A991.b.2.a
PackagingTray
Pin Count165
AutomotiveNo
Lead ShapeBall
PCB changed165
Part StatusObsolete
Timing TypeSynchronous
ArchitecturePipelined
Package Width13
Package Height0.95
Package Length15
Number of Ports1
Number of Words512K
Supplier PackageFBGA
Chip Density (bit)18M
Max. Access Time (ns)0.45
Standard Package NameBGA
Data Rate ArchitectureDDR
Operating Current (mA)600
Address Bus Width (bit)19
Maximum Clock Rate (MHz)300
Number of Bits/Word (bit)36
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
SRAM Chip Sync Single 1.8V 18M-bit 512K x 36 0.45ns 165-Pin FBGA Tray
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