Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Through Hole |
Standard | BSI|DIN|EN|FIMKO|UL|VDE |
ECCN (US) | EAR99 |
Pin Count | 4 |
Automotive | No |
Input Type | DC |
Lead Shape | Wide Lead Spacing Through Hole |
Output Type | DC |
PCB changed | 4 |
Part Status | Active |
Output Device | Transistor |
Package Width | 6.3 |
Package Height | 3.6 |
Package Length | 4.75(Max) |
Supplier Package | DIL |
Standard Package Name | DIP |
Typical Fall Time (us) | 4.7 |
Typical Rise Time (us) | 3 |
Maximum Forward Voltage (V) | 1.6 |
Maximum Reverse Voltage (V) | 6 |
Number of Channels per Chip | 1 |
Typical Forward Voltage (V) | 1.25 |
Maximum Forward Current (mA) | 60 |
Maximum Collector Current (mA) | 50 |
Maximum Power Dissipation (mW) | 265 |
Minimum Isolation Voltage (Vrms) | 5000 |
Maximum Current Transfer Ratio (%) | 200 |
Minimum Current Transfer Ratio (%) | 100 |
Maximum Operating Temperature (°C) | 110 |
Minimum Operating Temperature (°C) | -40 |
Maximum Collector-Emitter Voltage (V) | 70 |
Current Transfer Ratio Test Current (mA) | 10 |
Maximum Collector-Emitter Saturation Voltage (mV) | 300 |
Description |