Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Standard | BSI|CSA|cUL|FIMKO|IEC|UL |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 4 |
Automotive | No |
Input Type | DC |
Lead Shape | Gull-wing Lead (L-Lead) |
Output Type | DC |
PCB changed | 4 |
Part Status | Active |
Output Device | Transistor |
Package Width | 4.4 |
Package Height | 1.9 |
Package Length | 2.8(Max) |
Supplier Package | Mini-Flat |
Standard Package Name | SOIC |
Typical Fall Time (us) | 4.7 |
Typical Rise Time (us) | 3 |
Maximum Forward Voltage (V) | 1.6 |
Maximum Reverse Voltage (V) | 6 |
Number of Channels per Chip | 1 |
Typical Forward Voltage (V) | 1.25 |
Maximum Forward Current (mA) | 60 |
Maximum Collector Current (mA) | 50 |
Maximum Power Dissipation (mW) | 250 |
Minimum Isolation Voltage (Vrms) | 3750 |
Maximum Current Transfer Ratio (%) | 300 |
Minimum Current Transfer Ratio (%) | 100 |
Maximum Operating Temperature (°C) | 100 |
Minimum Operating Temperature (°C) | -40 |
Maximum Collector-Emitter Voltage (V) | 70 |
Current Transfer Ratio Test Current (mA) | 5 |
Maximum Collector-Emitter Saturation Voltage (mV) | 300 |
Description |