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EDB1332BDBH-1DAAT-F-D
EDB1332BDBH-1DAAT-F-D
DRAM Chip EDB1332BDBH-1DAAT-F-D
Micron Technology
EDB1332BDBH-1DAAT-F-D
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR2 SDRAM
ECCN (US)EAR99
PackagingDry
Pin Count134
AutomotiveUnknown
Lead ShapeBall
PCB changed134
Part StatusObsolete
Organization32Mx32
Package Width10
Interface TypeHSUL_12
Package Height0.58(Min)
Package Length11.5
Supplier PackageFBGA
Chip Density (bit)1G
Data Bus Width (bit)32
Standard Package NameBGA
Address Bus Width (bit)13
Maximum Clock Rate (MHz)533
Number of Internal Banks8
Number of Words per Bank4M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeAutomotive
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95|1.3
Minimum Operating Supply Voltage (V)1.7|1.14
Typical Operating Supply Voltage (V)1.2
Description
DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 32Mx32 1.2V Automotive 134-Pin FBGA Dry
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