Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile LPDDR3 SDRAM |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 216 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 216 |
Part Status | Obsolete |
Organization | 256Mx64 |
Package Width | 12 |
Package Height | 0.55 |
Package Length | 12 |
Supplier Package | BGA |
Chip Density (bit) | 16G |
Process Technology | CMOS |
Data Bus Width (bit) | 64 |
Standard Package Name | BGA |
Operating Current (mA) | 460 |
Address Bus Width (bit) | 14 |
Maximum Access Time (ns) | 5.5 |
Maximum Clock Rate (MHz) | 933 |
Number of Internal Banks | 8 |
Number of Words per Bank | 32M |
Number of Bits/Word (bit) | 64 |
Number of I/O Lines (bit) | 64 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -30 |
Maximum Operating Supply Voltage (V) | 1.3|1.95 |
Minimum Operating Supply Voltage (V) | 1.7|1.14 |
Typical Operating Supply Voltage (V) | 1.2|1.8 |
Description |