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K4AAG085WB-MCRC
K4AAG085WB-MCRC
DRAM Chip K4AAG085WB-MCRC
Samsung Electronics
K4AAG085WB-MCRC
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.36
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
Pin Count78
AutomotiveNo
PCB changed78
Part StatusActive
Organization2Gx8
Package Width7.5
Package Length13.3
Supplier PackageFBGA
Chip Density (bit)16G
Data Bus Width (bit)8
Maximum Clock Rate (MHz)2400
Number of Internal Banks16
Number of Words per Bank128M
Number of Bits/Word (bit)8
Number of I/O Lines (bit)8
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Typical Operating Supply Voltage (V)1.2
Description
DRAM Chip DDR4 SDRAM 16Gbit 2Gx8 1.2V 78-Pin FBGA
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