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K4AAG165WA-BCWE
K4AAG165WA-BCWE
DRAM Chip K4AAG165WA-BCWE
Samsung Electronics
K4AAG165WA-BCWE
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.36
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
Pin Count96
AutomotiveNo
PCB changed96
Part StatusPreliminary
Organization1Gx16
Package Width10.3
Interface TypePOD
Package Height0.98(Max)
Package Length13.3
Supplier PackageFBGA
Chip Density (bit)16G
Data Bus Width (bit)16
Standard Package NameBGA
Maximum Clock Rate (MHz)3200
Number of Internal Banks16
Number of Words per Bank64M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)0
Typical Operating Supply Voltage (V)1.2
Description
DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V 96-Pin FBGA
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