Product Attribute | Attribute Value |
HTS | 8542.32.00.36 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR3L SDRAM |
ECCN (US) | EAR99 |
Pin Count | 96 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 96 |
Part Status | Active |
Organization | 128Mx16 |
Package Width | 7.5 |
Package Height | 0.73 |
Package Length | 13.3 |
Supplier Package | FBGA |
Chip Density (bit) | 2G |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 118 |
Address Bus Width (bit) | 17 |
Maximum Access Time (ns) | 0.225 |
Maximum Clock Rate (MHz) | 1600 |
Number of Internal Banks | 8 |
Number of Words per Bank | 16M |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.45|1.575 |
Minimum Operating Supply Voltage (V) | 1.283|1.425 |
Typical Operating Supply Voltage (V) | 1.35|1.5 |
Description |