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DRAM Chip K4D263238K-VC50000
Samsung Electronics
K4D263238K-VC50000
--
Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeGDDR SDRAM
ECCN (US)EAR99
Pin Count144
AutomotiveNo
Lead ShapeBall
PCB changed144
Part StatusObsolete
Organization4Mx32
Package Width12
Interface TypeSSTL_2
Package Height1(Max)
Package Length12
Supplier PackageFBGA
Chip Density (bit)128M
Data Bus Width (bit)32
Standard Package NameBGA
Operating Current (mA)334
Address Bus Width (bit)14
Maximum Access Time (ns)0.7
Maximum Clock Rate (MHz)400
Number of Internal Banks4
Number of Words per Bank1M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)65
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)2.625
Minimum Operating Supply Voltage (V)2.375
Typical Operating Supply Voltage (V)2.5
Description
DRAM Chip GDDR SDRAM 128Mbit 4Mx32 2.5V 144-Pin FBGA
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