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DRAM Chip K4X1G323PD-8GC3000
Samsung Electronics
K4X1G323PD-8GC3000
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Memory
DRAM Chip
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| DRAM Type | Mobile-DDR SDRAM |
| ECCN (US) | EAR99 |
| Pin Count | 90 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 90 |
| Part Status | Obsolete |
| Organization | 32Mx32 |
| Package Width | 11 |
| Package Height | 1(Max) - 0.25(Min) |
| Package Length | 13 |
| Supplier Package | FBGA |
| Chip Density (bit) | 1G |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Number of Bits/Word (bit) | 32 |
| Number of I/O Lines (bit) | 32 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Description |
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