Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | RLDRAM3 |
ECCN (US) | EAR99 |
Pin Count | 168 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 168 |
Part Status | Obsolete |
Organization | 32Mx18 |
Package Width | 13.5 |
Interface Type | CMOS |
Package Height | 1.1 - 0.3(Min) |
Package Length | 13.5 |
Supplier Package | FBGA |
Chip Density (bit) | 576M |
Data Bus Width (bit) | 18 |
Standard Package Name | BGA |
Operating Current (mA) | 1085 |
Address Bus Width (bit) | 24 |
Maximum Clock Rate (MHz) | 50 |
Number of Internal Banks | 16 |
Number of Words per Bank | 2M |
Number of Bits/Word (bit) | 18 |
Number of I/O Lines (bit) | 18 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.42|2.63 |
Minimum Operating Supply Voltage (V) | 1.28|2.38 |
Typical Operating Supply Voltage (V) | 1.35 |
Description |