Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | RLDRAM3 |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 168 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 168 |
Part Status | Active |
Organization | 32Mx36 |
Package Width | 13.5 |
Package Height | 0.7(Min) |
Package Length | 13.5 |
Supplier Package | BGA |
Chip Density (bit) | 1.125G |
Data Bus Width (bit) | 36 |
Standard Package Name | BGA |
Address Bus Width (bit) | 24 |
Maximum Clock Rate (MHz) | 1200 |
Number of Internal Banks | 16 |
Number of Words per Bank | 2M |
Number of Bits/Word (bit) | 36 |
Number of I/O Lines (bit) | 36 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 100 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.42 |
Minimum Operating Supply Voltage (V) | 1.28 |
Typical Operating Supply Voltage (V) | 1.35 |
Description |