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MT49H32M18SJ-25E:B TR
MT49H32M18SJ-25E:B TR
DRAM Chip MT49H32M18SJ-25E:B TR
Micron Technology
MT49H32M18SJ-25E:B TR
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeRLDRAM
ECCN (US)EAR99
PackagingTray
Pin Count144
AutomotiveNo
Lead ShapeBall
PCB changed144
Part StatusObsolete
Organization32Mx18
Package Width11
Interface TypeHSTL
Package Height0.7(Min)
Package Length18.5
Supplier PackageFBGA
Chip Density (bit)576M
Data Bus Width (bit)18
Standard Package NameBGA
Operating Current (mA)465
Address Bus Width (bit)26
Number of Internal Banks8
Number of Words per Bank4M
Number of Bits/Word (bit)18
Number of I/O Lines (bit)18
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip RLDRAM 576Mbit 32Mx18 1.8V 144-Pin FBGA Tray
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