Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | RLDRAM |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 144 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 144 |
Part Status | Obsolete |
Organization | 32Mx18 |
Package Width | 11 |
Interface Type | HSTL |
Package Height | 0.7(Min) |
Package Length | 18.5 |
Supplier Package | FBGA |
Chip Density (bit) | 576M |
Data Bus Width (bit) | 18 |
Standard Package Name | BGA |
Operating Current (mA) | 465 |
Address Bus Width (bit) | 26 |
Number of Internal Banks | 8 |
Number of Words per Bank | 4M |
Number of Bits/Word (bit) | 18 |
Number of I/O Lines (bit) | 18 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.9 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |