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MT46H16M32LFCX-6:B
MT46H16M32LFCX-6:B
DRAM Chip MT46H16M32LFCX-6:B
Micron Technology
MT46H16M32LFCX-6:B
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR SDRAM
ECCN (US)EAR99
PackagingTray
Pin Count90
AutomotiveNo
Lead ShapeBall
PCB changed90
Part StatusObsolete
Organization16Mx32
Package Width9
Interface TypeLVCMOS
Package Height0.65
Package Length13
Supplier PackageVFBGA
Chip Density (bit)512M
Data Bus Width (bit)32
Standard Package NameBGA
Operating Current (mA)115
Address Bus Width (bit)15
Maximum Access Time (ns)6.5|5
Maximum Clock Rate (MHz)166
Number of Internal Banks4
Number of Words per Bank4M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip Mobile LPDDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin VFBGA Tray
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