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MT47H16M16BG-3 IT:B TR
MT47H16M16BG-3 IT:B TR
DRAM Chip MT47H16M16BG-3 IT:B TR
Micron Technology
MT47H16M16BG-3 IT:B TR
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR2 SDRAM
ECCN (US)EAR99
PackagingTape and Reel
Pin Count84
AutomotiveNo
Lead ShapeBall
PCB changed84
Part StatusObsolete
Organization16Mx16
Package Width8
Interface TypeSSTL_18
Package Height0.8
Package Length14
Supplier PackageFBGA
Chip Density (bit)256M
Process TechnologyCMOS
Data Bus Width (bit)16
Standard Package NameBGA
Operating Current (mA)215
Address Bus Width (bit)15
Maximum Access Time (ns)0.45
Maximum Clock Rate (MHz)667
Number of Internal Banks4
Number of Words per Bank4M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin FBGA T/R
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