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MT47H32M16HR-37E IT:F
MT47H32M16HR-37E IT:F
DRAM Chip MT47H32M16HR-37E IT:F
Micron Technology
MT47H32M16HR-37E IT:F
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR2 SDRAM
ECCN (US)EAR99
PackagingTray
Pin Count84
AutomotiveNo
Lead ShapeBall
PCB changed84
Part StatusObsolete
Organization32Mx16
Package Width8
Interface TypeSSTL_18
Package Height0.8
Package Length12.5
Supplier PackageFBGA
Chip Density (bit)512M
Process TechnologyCMOS
Data Bus Width (bit)16
Standard Package NameBGA
Operating Current (mA)205
Address Bus Width (bit)15
Maximum Access Time (ns)0.5
Maximum Clock Rate (MHz)533
Number of Internal Banks4
Number of Words per Bank8M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA Tray
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