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MT47H64M8B6-3:D
MT47H64M8B6-3:D
DRAM Chip MT47H64M8B6-3:D
Micron Technology
MT47H64M8B6-3:D
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR2 SDRAM
ECCN (US)EAR99
PackagingTray
Pin Count60
AutomotiveNo
Lead ShapeBall
PCB changed60
Part StatusObsolete
Organization64Mx8
Package Width10
Interface TypeSSTL_18
Package Height0.8
Package Length10
Supplier PackageFBGA
Chip Density (bit)512M
Process TechnologyCMOS
Data Bus Width (bit)8
Standard Package NameBGA
Operating Current (mA)180
Address Bus Width (bit)16
Maximum Access Time (ns)0.45
Maximum Clock Rate (MHz)667
Number of Internal Banks4
Number of Words per Bank16M
Number of Bits/Word (bit)8
Number of I/O Lines (bit)8
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip DDR2 SDRAM 512Mbit 64Mx8 1.8V 60-Pin FBGA Tray
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