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DRAM Chip MT48H32M16LFB4-6 IT:CTR
Micron Technology
MT48H32M16LFB4-6 IT:CTR
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
EU RoHSSupplier Unconfirmed
DRAM TypeMobile LPSDR SDRAM
ECCN (US)EAR99
PackagingTray
Part StatusUnconfirmed
Organization32Mx16
Interface TypeLVTTL
Chip Density (bit)512M
Process TechnologyCMOS
Data Bus Width (bit)16
Operating Current (mA)100
Address Bus Width (bit)15
Maximum Access Time (ns)8|5
Maximum Clock Rate (MHz)166
Number of Internal Banks4
Number of Words per Bank8M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
Mobile LPSDR SDRAM
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