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MT48H32M16LFBF-75:B
MT48H32M16LFBF-75:B
DRAM Chip MT48H32M16LFBF-75:B
Micron Technology
MT48H32M16LFBF-75:B
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPSDR SDRAM
ECCN (US)EAR99
PackagingTray
Pin Count54
AutomotiveNo
Lead ShapeBall
PCB changed54
Part StatusObsolete
Organization32Mx16
Package Width8
Interface TypeLVTTL
Package Height0.65
Package Length9
Supplier PackageVFBGA
Chip Density (bit)512M
Process TechnologyCMOS
Data Bus Width (bit)16
Standard Package NameBGA
Operating Current (mA)90
Address Bus Width (bit)15
Maximum Access Time (ns)8|5.4
Maximum Clock Rate (MHz)133
Number of Internal Banks4
Number of Words per Bank8M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip Mobile LPSDR SDRAM 512Mbit 32Mx16 1.8V 54-Pin VFBGA Tray
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