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MT48LC2M32B2P-6:G
MT48LC2M32B2P-6:G
DRAM Chip MT48LC2M32B2P-6:G
Micron Technology
MT48LC2M32B2P-6:G
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeSDR SDRAM
ECCN (US)EAR99
Pin Count86
AutomotiveNo
Lead ShapeGull-wing
PCB changed86
Part StatusObsolete
Organization2Mx32
Package Width10.16
Interface TypeLVTTL
Package Height1(Max)
Package Length22.22
Supplier PackageTSOP-II
Chip Density (bit)64M
Process TechnologyCMOS
Data Bus Width (bit)32
Standard Package NameSOP
Operating Current (mA)180
Address Bus Width (bit)13
Maximum Access Time (ns)5.5|7.5|17
Maximum Clock Rate (MHz)167
Number of Internal Banks4
Number of Words per Bank512K
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Chip SDR SDRAM 64Mbit 2Mx32 3.3V 86-Pin TSOP-II
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