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MT53B512M32D2NP-062 WT:C TR
MT53B512M32D2NP-062 WT:C TR
DRAM Chip MT53B512M32D2NP-062 WT:C TR
Micron Technology
MT53B512M32D2NP-062 WT:C TR
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPUnknown
EU RoHSSupplier Unconfirmed
MountingSurface Mount
DRAM TypeMobile LPDDR4 SDRAM
ECCN (US)EAR99
Pin Count200
AutomotiveUnknown
PCB changed200
Part StatusObsolete
Organization512Mx32
Supplier PackageWFBGA
Chip Density (bit)16G
Process TechnologyCMOS
Data Bus Width (bit)32
Operating Current (mA)395
Address Bus Width (bit)18
Maximum Access Time (ns)10
Maximum Clock Rate (MHz)3200
Number of Internal Banks16
Number of Words per Bank32M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-30
Maximum Operating Supply Voltage (V)1.17
Minimum Operating Supply Voltage (V)1.06
Typical Operating Supply Voltage (V)1.1
Description
DRAM Chip Mobile LPDDR4 SDRAM 16Gbit 512Mx32 1.1V 200-Pin WFBGA
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