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MT53D512M32D2DS-053 WT:D
MT53D512M32D2DS-053 WT:D
DRAM Chip MT53D512M32D2DS-053 WT:D
Micron Technology
MT53D512M32D2DS-053 WT:D
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
DRAM TypeMobile LPDDR4 SDRAM
ECCN (US)EAR99
AutomotiveNo
Part StatusUnconfirmed
Organization512Mx32
Chip Density (bit)16G
Process TechnologyCMOS
Data Bus Width (bit)32
Operating Current (mA)300
Address Bus Width (bit)19
Maximum Access Time (ns)3.5
Maximum Clock Rate (MHz)3733
Number of Internal Banks16
Number of Words per Bank32M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Maximum Operating Supply Voltage (V)1.17|1.95
Minimum Operating Supply Voltage (V)1.06|1.7
Typical Operating Supply Voltage (V)1.1|1.8
Description
DRAM Chip Mobile LPDDR4 SDRAM 16Gbit 512Mx32 1.1V/1.8V 200-Pin WFBGA
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