Product Attribute | Attribute Value |
Type | General Purpose |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Output Type | CMOS|LVCMOS |
PCB changed | 8 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 3.98(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC |
Maximum Data Rate | 50Mbps |
Process Technology | CMOS |
Maximum Fall Time (ns) | 5.3 |
Maximum Rise Time (ns) | 5.3 |
Forward/Reverse Channels | 2/0 |
Minimum Pulse Width (ns) | 20 |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 72 |
Minimum Isolation Voltage (Vrms) | 3000 |
Maximum Output Current Drive (mA) | 15 |
Maximum Working Insulation Voltage | 637Vp |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 8.2 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.89|5.5 |
Minimum Operating Supply Voltage (V) | 1.71|2.25 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
Minimum Common Mode Rejection (kV/us) | 100 |
Maximum Propagation Delay Time (tPHL) (ns) | 24 |
Maximum Propagation Delay Time (tPLH) (ns) | 24 |
Description |