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LE25U81AMCTWG
LE25U81AMCTWG
Flash LE25U81AMCTWG
onsemi
LE25U81AMCTWG
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Page Size256byte
Pin Count8
AutomotiveNo
Boot BlockNo
Lead ShapeGull-wing
ECC SupportNo
PCB changed8
Part StatusActive
Sector Size64Kbyte x 16
Timing TypeSynchronous
ArchitectureSectored
Package Width3.9
Interface TypeSerial-SPI
Package Height1.5
Package Length4.9
Number of Words1M
ProgrammabilityYes
Supplier PackageSOIC
Chip Density (bit)8M
Command CompatibleYes
Process TechnologyCMOS
Support of Page ModeYes
Max. Access Time (ns)9
Standard Package NameSOP
Maximum Erase Time (S)2.5/Sector
Operating Current (mA)10
Address Bus Width (bit)24
Programming Voltage (V)2.3 to 2.7
Number of Bits/Word (bit)8
Minimum Endurance (Cycles)1000000(Typ)
Maximum Programming Time (ms)6/Page
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.3
Typical Operating Supply Voltage (V)2.5
Description
Flash Serial-SPI 2.5V 8M-bit 1M x 8 9ns 8-Pin SOIC T/R
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