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MTFC32GHKDN-WT
MTFC32GHKDN-WT
Flash MTFC32GHKDN-WT
Micron Technology
MTFC32GHKDN-WT
--
Memory
Flash
Specification
Product AttributeAttribute Value
HTS8542.32.00.71
PPAPNo
EU RoHSCompliant
MountingSurface Mount
Cell TypeNAND
ECCN (US)3A991.b.1.a
PackagingTray
Pin Count169
AutomotiveNo
Boot BlockNo
Lead ShapeBall
PCB changed169
Part StatusUnconfirmed
Timing TypeSynchronous
Interface TypeSerial e-MMC
Number of Words4G
ProgrammabilityYes
Supplier PackageFBGA
Chip Density (bit)32G
Standard Package NameBGA
Number of Bits/Word (bit)8
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Typical Operating Supply Voltage (V)3.3
Description
NAND Flash Serial e-MMC 3.3V 32G-bit 4G x 8 169-Pin FBGA Tray
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