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S25FL256SDSBHB210
S25FL256SDSBHB210
Flash S25FL256SDSBHB210
Cypress
S25FL256SDSBHB210
--
Memory
Flash
Specification
Product AttributeAttribute Value
PPAPUnknown
EU RoHSCompliant
MountingSurface Mount
Cell TypeNOR
ECCN (US)3A991.b.1.a
PackagingTray
Page Size256byte|512byte
Pin Count24
AutomotiveYes
Boot BlockYes
ECC SupportYes
PCB changed24
Part StatusActive
Timing TypeSynchronous
ArchitectureSectored
Package Width6
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Package Height1.2(Max) - 0.2(Min)
Package Length8
Number of Words256M/128M/64M
ProgrammabilityYes
Supplier PackageBGA
Block OrganizationSymmetrical
Chip Density (bit)256M
Command CompatibleYes
Process Technology65nm, MirrorBit
Program Current (mA)100
Support of Page ModeNo
Max. Access Time (ns)14.5
Location of Boot BlockBottom|Top
Maximum Erase Time (S)330/Bulk
Operating Current (mA)100
Address Bus Width (bit)32
Programming Voltage (V)2.7 to 3.6
Number of Bits/Word (bit)1/2/4
Minimum Endurance (Cycles)100000
Maximum Programming Time (ms)0.75/Page
Maximum Operating Frequency (MHz)133
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Description
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 14.5ns Automotive 24-Pin BGA Tray
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