Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
Bank Size | 8/8/24/24Mb |
Cell Type | NOR |
ECCN (US) | 3A991.B.1.A |
Packaging | Tray |
Page Size | 8Words |
Pin Count | 48 |
Automotive | No |
Boot Block | Yes |
Lead Shape | Ball |
ECC Support | No |
PCB changed | 48 |
Part Status | Obsolete |
Sector Size | 8Kbyte x 16|64Kbyte x 126 |
Timing Type | Asynchronous |
Architecture | Sectored |
Package Width | 6.15 |
Interface Type | Parallel |
Package Height | 1(Max) - 0.18(Min) |
Package Length | 8.15 |
Number of Banks | 4 |
Number of Words | 4M |
Programmability | Yes |
Supplier Package | FBGA |
Block Organization | Asymmetrical |
Chip Density (bit) | 64M |
Command Compatible | Yes |
Process Technology | 110nm |
OE Access Time (ns) | 25 |
Program Current (mA) | 25 |
Support of Page Mode | Yes |
Max. Access Time (ns) | 60 |
Standard Package Name | BGA |
Location of Boot Block | Bottom|Top |
Maximum Erase Time (S) | 113.6/Chip |
Operating Current (mA) | 55 |
Page Read Current (mA) | 15 |
Address Bus Width (bit) | 22 |
Programming Voltage (V) | 2.7 to 3.6|8.5 to 9.5 |
Number of Bits/Word (bit) | 16 |
Minimum Endurance (Cycles) | 1000000 |
Supplier Temperature Grade | Industrial |
Maximum Page Access Time (ns) | 25 |
Maximum Programming Time (ms) | 50400/Chip |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Description |