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IGBT Chip FGHL50T65MQDT
onsemi
FGHL50T65MQDT
--
Diodes, Transistors and Thyristors
IGBT Chip
Specification
| Product Attribute | Attribute Value |
| Tab | Tab |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Through Hole |
| Packaging | Tube |
| Pin Count | 3 |
| Automotive | No |
| Technology | Trench|Field Stop |
| PCB changed | 3 |
| Part Status | Active |
| Channel Type | N |
| Configuration | Single |
| Package Width | 4.7 |
| Package Height | 20.57 |
| Package Length | 15.62 |
| Supplier Package | TO-247 |
| Maximum Power Dissipation (mW) | 268000 |
| Maximum Gate Emitter Voltage (V) | ±20 |
| Maximum Operating Temperature (°C) | 175 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Collector-Emitter Voltage (V) | 650 |
| Maximum Continuous Collector Current (A) | 80 |
| Maximum Gate Emitter Leakage Current (uA) | 0.4 |
| Typical Collector Emitter Saturation Voltage (V) | 1.45 |
| Description |
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