Product Attribute | Attribute Value |
HTS | 8541.21.00.95 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 3 |
Automotive | No |
PCB changed | 3 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 1.04(Max) |
Package Height | 0.35(Max) |
Package Length | 0.64(Max) |
Product Category | Small Signal |
Supplier Package | PicoStar |
Maximum IDSS (uA) | 0.1 |
Process Technology | NexFET |
Typical Fall Time (ns) | 3.4 |
Typical Rise Time (ns) | 1.3 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 500 |
Typical Gate Charge @ Vgs (nC) | 1.01@4.5V |
Maximum Gate Source Voltage (V) | 12 |
Typical Turn-On Delay Time (ns) | 3.3 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 10.6 |
Typical Gate to Drain Charge (nC) | 0.13 |
Maximum Gate Threshold Voltage (V) | 1.1 |
Typical Gate Threshold Voltage (V) | 0.85 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 1.5 |
Typical Input Capacitance @ Vds (pF) | 145@15V |
Maximum Drain Source Resistance (MOhm) | 240@8V |
Maximum Gate Source Leakage Current (nA) | 50 |
Description |