Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 6 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | P |
Configuration | Dual Common Dual Source |
Package Width | 1.3 |
Package Height | 0.65 |
Package Length | 1.8 |
Product Category | Power MOSFET |
Supplier Package | DSBGA |
Process Technology | NexFET |
Standard Package Name | BGA |
Typical Fall Time (ns) | 16 |
Typical Rise Time (ns) | 1.7 |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 800 |
Typical Gate Charge @ Vgs (nC) | 1.5@4.5V |
Maximum Gate Source Voltage (V) | ±8 |
Typical Turn-On Delay Time (ns) | 3 |
Maximum Drain Source Voltage (V) | 20 |
Typical Turn-Off Delay Time (ns) | 38 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 1.2 |
Typical Input Capacitance @ Vds (pF) | 150@10V |
Maximum Drain Source Resistance (mOhm) | 100@4.5V |
Description |