PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 6 |
Part Status | Active |
Channel Mode | Enhancement |
Channel Type | N|P |
Configuration | Dual |
Package Width | 2 |
Package Height | 0.56 |
Package Length | 2 |
Product Category | Power MOSFET |
Supplier Package | UDFN EP |
Maximum IDSS (uA) | 1 |
Standard Package Name | DFN |
Typical Fall Time (ns) | 3.7@N Channel|12.7@P Channel |
Typical Rise Time (ns) | 9.4@N Channel|3.6@P Channel |
Number of Elements per Chip | 2 |
Maximum Power Dissipation (mW) | 1890 |
Typical Gate Charge @ Vgs (nC) | 7.9@3.3V|10.5@4.5V|18.5@8V@N Channel|5.2@3.3V|6.7@4.5V|11.5@8V@P Channel |
Maximum Gate Source Voltage (V) | ±8 |
Typical Output Capacitance (pF) | 203@N Channel|87@P Channel |
Typical Turn-On Delay Time (ns) | 4.6@N Channel|3.5@P Channel |
Maximum Drain Source Voltage (V) | 12@N Channel|20@P Channel |
Typical Gate Plateau Voltage (V) | 1.7 |
Typical Turn-Off Delay Time (ns) | 15.7@N Channel|20.8@P Channel |
Maximum Diode Forward Voltage (V) | 1.2 |
Typical Diode Forward Voltage (V) | 0.7 |
Typical Gate to Drain Charge (nC) | 2.9@N Channel|2@P Channel |
Maximum Gate Threshold Voltage (V) | 1 |
Minimum Gate Threshold Voltage (V) | 0.4 |
Typical Gate to Source Charge (nC) | 1.2@N Channel|1@P Channel |
Typical Reverse Recovery Time (ns) | 12@N Channel|13.1@P Channel |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 6@N Channel|3.4@P Channel |
Operating Junction Temperature (°C) | -55 to 150 |
Typical Input Capacitance @ Vds (pF) | 787@6V@N Channel|576@10V@P Channel |
Typical Reverse Recovery Charge (nC) | 1.8@N Channel|3.9@P Channel |
Maximum Drain Source Resistance (mOhm) | 25@4.5V@N Channel|80@4.5V@P Channel |
Maximum Gate Source Leakage Current (nA) | 10000 |
Maximum Positive Gate Source Voltage (V) | 8 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 40@N Channel|20@P Channel |
Maximum Power Dissipation on PCB @ TC=25°C (W) | 1.89 |
Typical Reverse Transfer Capacitance @ Vds (pF) | 177@6V@N Channel|71@10V@P Channel |
Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 6@N Channel|3.4@P Channel |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 92 |
Description | |