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IMBG65R072M1HXTMA1
IMBG65R072M1HXTMA1
MOSFETs IMBG65R072M1HXTMA1
Infineon
IMBG65R072M1HXTMA1
--
Diodes, Transistors and Thyristors
MOSFETs
Specification
Product AttributeAttribute Value
HTS8541.29.00.95
TabTab
EU RoHSCompliant
MaterialSiC
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count8
PCB changed7
Part StatusActive
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle Hex Source
Package Width9.25
Package Height4.4
Package Length10
Product CategoryPower MOSFET
Supplier PackageTO-263
Process TechnologyTrenchFET
Typical Fall Time (ns)7
Typical Rise Time (ns)7.9
Number of Elements per Chip1
Maximum Power Dissipation (mW)140000
Typical Gate Charge @ Vgs (nC)22@18V
Maximum Gate Source Voltage (V)23
Typical Turn-On Delay Time (ns)6.1
Maximum Drain Source Voltage (V)650
Typical Turn-Off Delay Time (ns)12.1
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)33
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)744@400V
Maximum Drain Source Resistance (MOhm)94@18V
Description
Trans MOSFET N-CH SiC 650V 33A 8-Pin(7+Tab) TO-263 T/R
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