Product Attribute | Attribute Value |
Tab | Tab |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 3 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 2 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single |
Package Width | 9.65(Max) |
Package Height | 4.83(Max) |
Package Length | 10.67(Max) |
Product Category | Power MOSFET |
Supplier Package | D2PAK |
Process Technology | HEXFET |
Standard Package Name | TO-263 |
Typical Fall Time (ns) | 51 |
Typical Rise Time (ns) | 130 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 3800 |
Typical Gate Charge @ 10V (nC) | 93 |
Typical Gate Charge @ Vgs (nC) | 93@10V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 25 |
Maximum Drain Source Voltage (V) | 80 |
Typical Turn-Off Delay Time (ns) | 47 |
Maximum Operating Temperature (°C) | 175 |
Minimum Operating Temperature (°C) | -55 |
Maximum Continuous Drain Current (A) | 95 |
Typical Input Capacitance @ Vds (pF) | 5450@25V |
Maximum Drain Source Resistance (MOhm) | 10@10V |
Description |