Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Material | Si |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 7 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 7 |
Part Status | Obsolete |
Channel Mode | Enhancement |
Channel Type | N |
Configuration | Single Dual Drain Dual Source |
Package Width | 5.05(Max) |
Package Height | 0.53(Max) |
Package Length | 5.45(Max) |
Product Category | Power MOSFET |
Supplier Package | Direct-FET MX |
Maximum IDSS (uA) | 100 |
Process Technology | HEXFET |
Typical Fall Time (ns) | 15 |
Typical Rise Time (ns) | 37 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 2800 |
Typical Gate Charge @ Vgs (nC) | 42@4.5V |
Maximum Gate Source Voltage (V) | ±20 |
Typical Turn-On Delay Time (ns) | 22 |
Maximum Drain Source Voltage (V) | 30 |
Typical Turn-Off Delay Time (ns) | 20 |
Maximum Gate Threshold Voltage (V) | 2.35 |
Maximum Operating Temperature (°C) | 150 |
Minimum Operating Temperature (°C) | -40 |
Maximum Continuous Drain Current (A) | 31 |
Typical Input Capacitance @ Vds (pF) | 6030@15V |
Maximum Drain Source Resistance (MOhm) | 1.8@10V |
Maximum Gate Source Leakage Current (nA) | 100 |
Description |